
Thermal management for Single Board Computers (SBCs) is essential in getting maximum performance out of it. A passive cooling like a heatsink alone might no longer sufficient to prevent thermal throttle especially under a continuous heavy load. A better solution would be a combination of a passive and active cooling. A fan used in combination with a heatsink can reasonably keep the temperature down.
This Heatsink and Fan (HSF) measures 25 x 25 mm, comes with a thermal adhesive layer that can be fixed on the SoC - the main chip of the SBC. The fan is attached to the heatsink with 4 screws. There is a 2-pin lead that come out of it and need to be connected to GPIO pin (Red: +5V, Black: GND).
Technical details: